Academic Internship – Investigation of Cu‑pillar Underfill for Semiconductor Applications

About the role

This academic internship focuses on investigating Cu‑pillar underfill materials for semiconductor applications. You will work within Bosch Car Multimedia’s BrgP laboratory and collaborate with the University of Minho to advance material reliability research.

Key responsibilities

• Conduct a state‑of‑the‑art review of underfill materials used in the semiconductor industry.
• Identify relevant material properties influencing reliability.
• Perform material characterization including thermal analysis, rheology, chemical analysis, DMA and TMA.
• Implement shear and adhesion strength testing methods in the Bosch BrgP facility.
• Define and execute nano‑indentation test methods.
• Collaborate with laboratory, production environments and university partners for testing.

Required profile

• Knowledge of materials characterization techniques, chemical analysis and material science.
• Familiarity with testing and statistical methods.
• Strong background in Materials Engineering or Mechanical Engineering.
• Proficiency with Microsoft Office tools.
• Experience working in a laboratory environment (mandatory).
• Excellent written and verbal communication skills in English.
• Team‑working, adaptability and critical thinking abilities.

Required skills

• Thermal analysis
• Rheology
• Chemical analysis
• Dynamic Mechanical Analysis (DMA)
• Thermomechanical Analysis (TMA)
• Shear and adhesion strength testing
• Nano‑indentation
• Microsoft Office

What we offer

• Opportunity to work with a global leader in automotive electronics.
• Collaboration with international colleagues and university researchers.
• Access to on‑site medical and social services.