Academic Internship in Mechanical Engineering

About the role

This internship focuses on improving the accuracy of simulation models used for printed circuit board assembly (PCBa) manufacturing. You will work on material characterization, reflow soldering processes, and digital‑twin creation to predict quality and defect probability.

Key responsibilities

• Conduct literature review and familiarize with productive PCB assembly processes.
• Perform experimental and analytical material characterization related to reflow soldering.
• Develop and refine simulation models using Ansys software.
• Implement Python‑based automation for simulation workflows.
• Analyze simulation results to assess model accuracy and suggest improvements.

Required profile

• Enrolled in a Mechanical Engineering or related academic program.
• Strong interest in manufacturing processes and simulation.
• Ability to work independently and collaborate with a multidisciplinary team.

Required skills

• Python programming for automation.
• Experience with Ansys simulation software.
• Knowledge of material characterization techniques.
• Understanding of PCB assembly and reflow soldering processes.

What we offer

• Hands‑on experience with cutting‑edge simulation tools.
• Mentorship from experts in automotive electronics.
• Opportunity to contribute to a high‑impact research project.